1. Heterogeneous integration building the foundation for innovative products;Reichl,2009
2. Methods of analysing thermomechanical stress in plastic packages for integrated circuits
3. Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam X-ray topography
4. D. Manessis, S.F. Yen, A. Ostmann, R. Aschenbrenner, H. Reichl, in: Proceedings of the 57th IEEE Electronic Components and Technology Conference, 2007, pp. 278–285.
5. K.H. Lu, Xuefeng Zhang, Suk-Kyu Ryu, J. Im, Rui Huang, P.S. Ho, in: Proceedings of the IEEE Electronic Components and Technology Conference, 2009, pp. 630–634.