Author:
Slattery O.,Hayes T.,Lawton W.,Kelly G.,Lyden C.,Barrett J.,O'Mathuna C.
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
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2. Piezoresistive stress sensors for structural analysis of electronic packages;Bittle;J. Electronic Packaging,1991
3. Die surface stresses in a molded plastic package;Natarajan,1986
4. Acoustic evaluation of electronic plastic packages;Siettmann,1992
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