Flip-Chip Underfill: Materials, Process and Reliability-Reference-Cited by-同舟云学术

Flip-Chip Underfill: Materials, Process and Reliability

Published:2009 Issue: Volume: Page:307-337
ISSN:
Container-title:Materials for Advanced Packaging
language:
Short-container-title:

Author:

Zhang Zhuqing,Wong C. P.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-0-387-78219-5_9.pdf

Reference81 articles.

1. C.P. Wong, S. Lou, and Z. Zhang, “Flip the Chip”, Science, Vol. 290, p. 2269, Dec, 2000.

2. E. Davis, W. Harding, R. Schwartz, and J. Coring, “Solid Logic Technology: Verdatile High Performance Microelectronics”, IBM Journal of Research & Development, Vol. 8, p. 102, 1964.

3. F. Nakano, T. Soga, and S. Amagi, “Resin-Insertion Effect on Thermal Cycle Resistivity of Flip-Chip Mounted LSI Devices”, The Proceedings of the International Society of Hybrid Microelectronics Conference, p. 536, 1987.

4. Y. Tsukada, “Surface Laminar Circuit and Flip-Chip Attach Packaging”, Proceedings of the 42nd Electronic Components and Technology Conference, p. 22, 1992.

5. B. Han and Y.Guo, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moire and Microscope Moire Interferometry”, Journal Electronic Packaging, Vol. 117, p. 185, 1995.

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