1. Mukhopadhyay S, Long Y, Mudassar B, Nair C, DeProspo BH, Torun HM et al (2019) Heterogeneous integration for artificial intelligence: challenges and opportunities. IBM J Res Dev 63:1–4
2. Liu F, Zhang R, DeProspo BH, Dwarakanath S, Nimbalkar P, Ravichandran S et al (2020) Advances in high performance RDL technologies for enabling IO density of 500 IOs/mm/layer and 8-μm IO pitch using low-k dielectrics. In: 2020 IEEE 70th electronic components and technology conference (ECTC), 2020, pp 1132–1139
3. Heinig A (2015) Technology options and their influence on routing for interposer-based memory processor integration. https://www.3dincites.com/2015/01/technology-options-influence-routing-interposer-based-memory-processor-integration. Accessed 28 Jan 2015
4. Ishida M (2014) APX (advanced package X)—advanced organic technology for 2.5D interposer. In: CPMT seminar, latest advances in organic interposers, Lake Buena, Vista, Florida, USA, May 27–30, 2014
5. Nair C (2019) Modeling, design, materials, processes and reliability of multi-layer redistribution wiring layers on glass substrates for next generation of high-performance computing applications. Georgia Institute of Technology