Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages
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Publisher
Springer US
Link
http://link.springer.com/content/pdf/10.1007/978-1-4419-5719-1_14.pdf
Reference35 articles.
1. Fan, X.J., Zhou, J., Zhang, G.Q., Ernst, L.J., “A amicromechanics based vapor pressure model in electronic packages”, ASME Journal of Electronic Packaging, 127(3), 262–267, 2005.
2. Gallo, A., Munamarty, R., “Popcorning: a failure mechanism in plastic encapsulated microcircuits”, IEEE Transactions on Reliability, 44(3), 362–367, 1995.
3. Stellrecht, E., Bongtae, H., Pecht, M., “Characterization of hygroscopic swelling behavior of mold compound and plastic packages”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 27(3), 499–506, 2004.
4. Lebbai, M., Kim, J.K., Yuen, M.M.F., “Effects of moisture and elevated temperature on reliability of interfacial adhesion in plastic packages”, Journal of Electronic Materials, 32(6), 574–582, 2003.
5. Ardebili, H., Wong, E.H., Pecht, M., “Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging”, IEEE Transactions on Components and Packaging Technologies, 26(1), 206–214, 2003.
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