Analysis of a failure in a molded package caused by electrochemical migration

Author:

Dušek Karel,Bušek David,Veselý PetrORCID,Plaček Martin,Reichl Tomáš,Sedláček Josef,Mach Pavel

Funder

České Vysoké Učení Technické v Praze

Publisher

Elsevier BV

Subject

General Engineering,General Materials Science

Reference34 articles.

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2. Moisture sensitivity level (MSL) capability of plastic-encapsulated packages;Fauty,2010

3. Corrosion-induced tin whisker growth in electronic devices: a review;Illés;Solder. Surf. Mt. Technol.,2017

4. On the electrochemical migration mechanism of tin in electronics;Minzari;Corros. Sci.,2011

5. Corrosion and environmental effects on electronics;Ambat;Proc‘Korrosion–Mekanismer Havarier Beskyt.,2005

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