Moisture resistance evaluation on single electronic package moulding compound-Reference-Cited by-同舟云学术

Moisture resistance evaluation on single electronic package moulding compound

Author:

Tan Cher Ming¹²³⁴⁵,Narula Udit¹²³⁴,Seow Guan Ling⁶⁷⁸⁹,Sangwan Vivek¹²³⁴⁵^ORCID,Chen Ching Hsiang¹⁰¹¹⁴,Lin Shu Ping⁵²³⁴,Chen Jia Yuan⁵²³⁴

Affiliation:

1. Center for Reliability Sciences and Technologies

2. Chang Gung University

3. Taoyuan 33302

4. Taiwan

5. Department of Electronic Engineering

6. Department of Physics

7. Faculty of Science

8. National University of Singapore

9. Singapore

10. CL Technology Co., Limited

11. New Taipei

Abstract

Non-destructive evaluation indices that correlate with the moisture resistance of integrated circuit packages are developed.

Publisher

Royal Society of Chemistry (RSC)

Subject

Materials Chemistry,General Chemistry

Link

Reference51 articles.

2. H. Ardebili and M.Pecht , Encapsulation Technologies for Electronic Applications , Elsevier , 2009

3. G. Q. Xhang , W. D.van Driel and X. J.Fan , Mechanics of Microelectronics , Springer , New York, NY , 2006 , vol. 9

4. X. Fan , Electronic Component Technology Conference (ECTC) Professional Development Course Handout , 2008 , pp. 1–92

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