A Micromechanics-Based Vapor Pressure Model in Electronic Packages-Reference-Cited by-同舟云学术

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

Published:2004-06-26 Issue:3 Volume:127 Page:262-267
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Fan X. J.¹,Zhou J.²,Zhang G. Q.³,Ernst L. J.⁴

Affiliation:

1. Philips Research USA, 345 Scarborough Road, Briarcliff Manor, NY 10510

2. Department of Mechanical Engineering, Lamar University, Beaumont, TX 77710

3. Philips-CFT, P.O. Box 218, 5600 MD Eindhoven, The Netherlands

4. Delft University of Technology, Mekelweg 2, 2628 CD Delft, The Netherlands

Abstract

A complete vapor pressure model based on a micromechanics approach is developed in this paper. The model can be extended to calculate the initial vapor pressure as traction loading subjected to the interfaces after the delamination. The impact of the vapor pressure induced expanison on the material’s deformation is discussed.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/127/3/262/5804258/262_1.pdf

Reference9 articles.

1. Polymer Material Characterization and Modeling;Ernst

2. Moisture Absorption and Desorption Predictions for Plastic Ball Grid Array Packages;Galloway;IEEE Trans. Compon., Packag. Manuf. Technol., Part A

3. Moisture Diffision and Heat Transfer in Plastic IC Packages;Tay;IEEE Trans. Compon., Packag. Manuf. Technol., Part A

4. Void Behavior Due to Internal Vapor Pressure Induced by Temperature Rise;Fan;J. Mater. Sci.

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