1. Ostmann A, Kriechbaum A, De Baets J, Kostner H (2005) Chip embedding in printed circuit board production. IMAPS Nordic Conference 2005, Tønsberg, Norway
2. Pozder S, Jain A, Chatterjee R, Huang Z, Jones RE, Acosta E, Marlin B, Hillmann G, Sobczak M, Kreindl G, Kanagavel S, Kostner H, Pargfrieder, S (2008) 3D die-to-wafer Cu/Sn microconnects formed simultaneously with an adhesive dielectric bond using thermal compression bonding. IITC 2008, Colombo, Srilanka
3. Scheiring C, Kostner H, Lindner P, Pargfrieder S (2004) Flip chip-to-wafer stacking: Enabling technology for volume production of 3D system integration on wafer level. IMAPS Conference 2004, Long Beach, California, US