Reliable Peeling of Ultrathin Die With Multineedle Ejector

Author:

Liu Zunxu,Huang Yong An,Liu Huimin,Chen Jiankui,Yin Zhouping

Funder

National Natural Science Foundation of China

New Century Excellent Talents in University

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 26 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Thin IC Chip Pickup Process Risk Analysis via Experiments in conjunction with Numerical Approach;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Stress Analysis for Silicon Die Pick-up Process Through Finite Element Analysis;Transactions of the Korean Society of Mechanical Engineers - A;2023-09-30

3. Dynamic peeling process of IC chip from substrate based on a 3D analytical model;International Journal of Solids and Structures;2023-09

4. Peel tests for quantifying adhesion and toughness: A review;Progress in Materials Science;2023-08

5. Mass transfer techniques for large-scale and high-density microLED arrays;International Journal of Extreme Manufacturing;2022-11-14

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