Stress Analysis for Silicon Die Pick-up Process Through Finite Element Analysis
-
Published:2023-09-30
Issue:9
Volume:47
Page:695-700
-
ISSN:1226-4873
-
Container-title:Transactions of the Korean Society of Mechanical Engineers - A
-
language:en
-
Short-container-title:KSME-A
Author:
Kim Seungbin,Lee Yong-Seok
Publisher
The Korean Society of Mechanical Engineers
Subject
Mechanical Engineering