Fatigue and Creep Properties of Sintered Ag Paste from Room Temperature to High Temperature
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-030-36296-6_66
Reference13 articles.
1. Ide E, Angatas S, Hirose A, Kobayashi KF (2005) Metal-Metal bonding process using Ag metallo-organic nanoparticles. Acta Mater 53:2385–2393
2. Chen C, Suganuma K, Iwashige T, Sugiura K, Tsuruta K (2018) High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates. J Mater Sci Mater Electron 29:1785–1797
3. Chen C, Nagao S, Suganuma K, Jiu J, Zhang H, Sugahara T, Iwashige T, Sugiura K, Tsuruta K (2016) Self-healing of cracks in Ag joining layer for die-attachment in power devices. Appl Phys Lett 109:093503
4. Siow KS (2012) Mechanical properties of nano-silver joints as die attach materials. J Alloy Compd 514:6–19
5. Wang T, Chen X, Lu G-Q, Lei G-Y (2007) Low-temperature sintering with nano-silver paste in die-attached interconnection. J Electron Mater 36:1333–1340
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Mesostructural impact on the macroscopic stress state and yield locus of porous polycrystalline silver;Materials & Design;2022-07
2. Mechanical fatigue life analysis of solar panels under cyclic load conditions for design improvement;Journal of the Brazilian Society of Mechanical Sciences and Engineering;2022-02-18
3. A Parametric Simulative Study for Lifetime Prediction of Sintered Silver Die Attach Under Different Accelerated Testing Conditions;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19
4. Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature;Journal of Electronic Materials;2020-08-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3