Author:
Forndran Freerik,Heilmann Jens,Metzler Martin,Leicht Markus,Wunderle Bernhard
Cited by
6 articles.
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1. Mechanical Characterization of Sintered Silver Materials for Power Device Packaging: A Review;Energies;2024-08-18
2. Fracture Mechanism of Sintered Silver Film Revealed by In Situ SEM Uniaxial Tensile Loading;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-02
3. Modelling Creep Behaviour in Sintered Silver using User-Programmable Features in ANSYS;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
4. Reliability and Lifetime Estimation of Sintered Silver Die Attach for Different Accelerated Testing Conditions;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13
5. Determination of Rate- and Temperature Dependent Inelastic Material Data for Sintered Silver Die Attach and Simulative Implementation;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25