Author:
Letz S.A.,Zhao D.,März M.
Funder
Federal Ministry of Education and Research Berlin Office
Forschungsfabrik Mikroelektronik Deutschland
Bundesministerium für Bildung und Forschung
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference50 articles.
1. Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science;Wang;IEEE J. Emerg. Sel. Topics Power Electron.,2022
2. U. Scheuermann, P. Wiedl, Low temperature joining technology - a high reliability alternative to solder contacts, in: 3rd Workshop on Metal Ceramic Materials for Functional Applications, Wien, Austria, 1997. [Online]. Available: https://www.researchgate.net/publication/267794221_Low_temperature_joining_technology_-_a_high_reliability_alternative_to_solder_contacts.
3. M. Schaal, M. Klingler, B. Wunderle, Silver Sintering in Power Electronics: The State of the Art in Material Characterization and Reliability Testing, 7th Electronic System-Integration Technology Conference (ESTC), pp. 1–18, 2018, doi: 10.1109/ESTC.2018.8546498.
4. C. Chen, C. Choe, A. Suetake, K. Suganuma, Fatigue and Creep Properties of Sintered Ag Paste from Room Temperature to High Temperature, in: TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings, 2020, pp. 707–716.
5. Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design;Chen;J. Elec Materi,2017
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献