High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates-Reference-Cited by-同舟云学术

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High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates

Published:2017-10-23 Issue:3 Volume:29 Page:1785-1797
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Chen Chuantong,Suganuma Katsuaki,Iwashige Tomohito,Sugiura Kazuhiko,Tsuruta Kazuhiro

Funder

New Energy and Industrial Technology Development Organization

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s10854-017-8087-8/fulltext.html

Reference36 articles.

1. Y.S. Park, SiC Materials and Devices (Academic Press, San Diego, 1998), pp. 13–16

2. C. Buttay, D. Planson, B. Allard, D. Bergogne, P. Bevilacqua, C. Joubert, M. Lazar, C. Martin, H. Morel, D. Tournier, C. Raynaud, State of the art of high temperature power electronics. Mater. Sci. Eng. 176, 283–288 (2011)

3. M. Amagai, A study of nanoparticles in Sn–Ag based lead free solders. Microelectron. Reliab. 48, 1–16 (2008)

4. K. Suganuma, S.J. Kim, K.S. Kim, High-temperature lead-free solders: properties and possibilities. J. Miner. Met. Mater. Soc. 61, 64–71 (2009)

5. K. Suganuma, S. Sakamoto, N. Kagami, D. Wakuda, K.-S. Kim, M. Nogi, Low-temperature low-pressure die attach with hybrid silver particle paste. Microelectron. Reliab. 52, 375–380 (2012)

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