Author:
Calabretta Michele,Sitta Alessandro,Messina Angelo Alberto,Oliveri Salvatore Massimo,Sequenzia Gaetano
Publisher
Springer International Publishing
Reference18 articles.
1. Goehre, J., Schneider-Ramelow, M., Geißler, U., Lang, K.D.: Interface degradation of al heavy wire bonds on power semiconductors during active power cycling measured by the shear test. In: 2010 6th International Conference on Integrated Power Electronics Systems, pp. 1–6. IEEE (2010)
2. Sitta, A., Renna, M., Messina, A.A., Sequenzia, G., D’Arrigo, G., Calabretta, M.: Thermal measurement and numerical analysis for automotive power modules. In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1–3. IEEE (2020). https://doi.org/10.1109/EuroSimE48426.2020.9152204
3. Thoben, M., Sauerland, F., Mainka, K., Edenharter, S., Beaurenaut, L.: Lifetime modeling and simulation of power modules for hybrid electrical/electrical vehicles. Microelectron. Reliab. 54(9–10), 1806–1812 (2014). https://doi.org/10.1016/j.microrel.2014.07.009
4. Calabretta, M., Sitta, A., Oliveri, S.M., Sequenzia, G.: Experimental characterization and modeling of power module warpage during assembly process. Int. J. Interact. Des. Manuf. (IJIDeM) 15(1), 113–115 (2020). https://doi.org/10.1007/s12008-020-00735-z
5. Calabretta, M., Renna, M., Vinciguerra, V., Messina, A.A.: Power packages interconnections for high reliability automotive applications. In: ESSDERC 2019–49th European Solid-State Device Research Conference (ESSDERC), pp. 35–39. IEEE (2019). https://doi.org/10.1109/ESSDERC.2019.8901742
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