Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Modelling and Simulation
Reference4 articles.
1. Calabretta, M., Sitta, A., Oliveri, S. M., & Sequenzia, G.: Design and process optimization of a sintered joint for power electronics automotive applications. In: International Conference on Design, Simulation, Manufacturing: The Innovation Exchange (pp. 470–480). Springer, Cham (2019)
2. Mirone, G., Sitta, A., D’Arrigo, G., Calabretta, M.: Material characterization and warpage modeling for power devices active metal brazed substrates. IEEE Trans. Device Mater. Reliab. 19(3), 537–542 (2019)
3. Nishimura, Y., Kido, K., Momose, F., Goto, T.: Development of ultrasonic welding for IGBT module structure. In: 2010 22nd International Symposium on Power Semiconductor Devices & IC’s (ISPSD) (pp. 293–296). IEEE (2010)
4. Qian, R., Yao, A., Xu, B., Liu, Y., Chew, C.H.: High power module package mounting and temperature cycling reliability study by simulation. In 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (pp. 1578-1574). IEEE (2018)
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献