Warpage modeling and characterization of intelligent power modules (IPMs)

Author:

Shih Meng-Kai1ORCID,Lee Tai-Kuang2,Chang Jin-Gyao2

Affiliation:

1. Department of Mechanical and Computer-Aided Engineering, National Formosa University, Huwei, Yunlin, Taiwan

2. Intelligent Power Module & System Department, Electronic & Optoelectronic System Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan

Abstract

Abstract Intelligent power modules (IPMs) are widely used in the electric vehicle (and hybrid electric vehicle industry nowadays due to their high power density and ability to integrate multiple components within a single package. However, the reliability of IPMs is severely degraded by the substrate warpage effect produced during the packaging process. This study therefore develops a computational model to analyze the warpage of the IPM assembly at various stages of the packaging process. The validity of the simulation model is confirmed by comparing the numerical results for the warpage of the direct plated copper substrate with the experimental observations. Taguchi experiments are then performed to examine the effects of eight control factors on the IPM package warpage following the post-mold cure (PMC) process, namely (1) the dam bar layout, (2) the epoxy molding compound (EMC) thickness, (3) the lead frame thickness, (4) the ceramic thickness, (5) the bottom layer Cu foil thickness, (6) the top layer Cu foil thickness, (7) the ceramic material type and (8) the EMC material type. Finally, the Taguchi analysis results are used to determine the optimal packaging design that minimizes the warpage of the post-PMC package.

Funder

Ministry of Science and Technology

Publisher

Oxford University Press (OUP)

Subject

Applied Mathematics,Mechanical Engineering,Condensed Matter Physics

Reference16 articles.

1. New generation high performance intelligent power module series;Majumdar,1992

2. New generation of intelligent power devices for motor drive applications;Motto,1993

3. Thermo-mechanical behaviour of DBC substrate assemblies subject to soldering fabrication processes;Camilleri;Soldering and Surface Mount Technology,2012

4. Investigation of solder crack behavior and fatigue life of the power module on different thermal cycling period;Hung;Microelectronic Engineering,2013

5. Design for reliability of power electronics modules;Lu;Microelectronics and Reliability,2009

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