Publisher
Springer International Publishing
Reference33 articles.
1. Yang, Y., Dorn-Gomba, L., Rodriguez, R., Mak, C., Emadi, A.: Automotive power module packaging: current status and future trends. IEEE Access 8, 160126–160144 (2020). https://doi.org/10.1109/ACCESS.2020.3019775
2. Calabretta, M., Messina, A., Sitta, A.: Lifetime modeling for silicon carbide based power module. In: 15th International Conference on Engines & Vehicles, Technical paper 2021-24-0102 (September 2021). https://doi.org/10.4271/2021-24-0102. https://www.sae.org/content/2021-24-0102/
3. Schuderer, J., et al.: High-power SiC and Si module platform for automotive traction inverter. In: International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2019, May 2019, pp. 1–8 (2019)
4. Pellitteri, F., et al.: A prototypal PCB board for the EMI characterization of SiC-based innovative switching devices. In: 2020 IEEE 20th Mediterranean Electrotechnical Conference (MELECON), June 2020, pp. 52–56 (2020). ISSN 2158-8481. https://doi.org/10.1109/MELECON48756.2020.9140633
5. Pellitteri, F., et al.: Power losses comparison between Silicon Carbide and Silicon devices for an isolated DC-DC converter. In: 2021 IEEE 15th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG), July 2021, pp. 1–6 (2021). https://doi.org/10.1109/CPE-POWERENG50821.2021.9501191
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Directly Cooled Silicon Carbide Power Module: Pin-Fins Roughness Effect on Pressure Drop;Lecture Notes in Mechanical Engineering;2024
2. Warpage of transfer-molded automotive power modules – experimental characterization, numerical simulation and optimization;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17