Solid-liquid reactions: The effect of Cu content on Sn-Ag-Cu interconnects
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11837-005-0133-y.pdf
Reference22 articles.
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4. J-W. Yoon and S.-B. Jung, J. Mater. Sci., 39 (2004), p. 4211.
5. I. Shohji et al., Mater. Sci. Eng., A366 (2004), p. 50.
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