Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Cited by 53 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Dependence of mechanical and thermal deformation behaviors on crystal size and direction of Cu3Sn intermetallic: A molecular dynamics study;Alexandria Engineering Journal;2023-03
2. Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components;Journal of Materials Research and Technology;2022-11
3. Tensile properties dependency on crystal size and direction of single crystal Ag3Sn intermetallic compound: a molecular dynamics study;Journal of Materials Research and Technology;2022-09
4. Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints;IEEE Transactions on Device and Materials Reliability;2022-06
5. Effects of temperature and strain rate on tensile properties of (Ag,Cu)-Sn intermetallic compounds: A molecular dynamics study;Journal of Materials Research and Technology;2022-05
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