Funder
Nihon Superior
fundamental research grant scheme
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. S.H. Kim, J.M. Kim, S. Yoo, Y.B. Park, Effects of surface finishes and current stressing on the interfacial reaction characteristics of Sn-1.2Ag-0.7Cu-0.4In solder bumps. Curr. Appl. Phys. 13, 103–107 (2013)
2. K. Sweatman, Hot air solder leveling in the lead-free era, in Global SMT & Packaging, pp. 10–18 (2009)
3. J.-W. Yoon, S.-B. Jung, Effect of surface finish on interfacial reactions of Cu/Sn-Ag-Cu/Cu (ENIG) sandwich solder joints. J. Alloys Compd. 448, 177–184 (2008)
4. K. Sweatman, K. Howell, R. Coyle, R. Parker, G. Henshall, J. Smetana, E. Benedetto, W. Lui, R.S. Pandher, D. Daily, iNEMI Pb-free alloy characterization project report: part III–thermal fatigue results for low Ag alloys, in Proceeding of SMTAi (2012)
5. K. Nogita, Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys. Intermetallics 18, 145–149 (2010)
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