Effect of Sb Addition to the Solidification and Microstructure of Sn–Ag–Cu Alloys
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-9267-4_3
Reference10 articles.
1. W.N. C. Weng, Evolution of Pb-Free Solders. IntechOpen (2017)
2. L.M. Lee, A.A. Mohamad, Interfacial reaction of Sn–Ag–Cu lead-free solder alloy on Cu: a review. Adv. Mater. Sci. Eng. 2013, 1–11 (2013)
3. M. Zhao, L. Zhang, Z.Q. Liu, M.Y. Xiong, L. Sun, Structure and properties of Sn–Cu lead-free solders in electronics packaging. Sci. Technol. Adv. Mater. 20(1), 421–444 (2019)
4. Q. Guo, Z. Zhao, C. Shen, A comparison study on microstructure and mechanical properties of Sn-10Bi and Sn–Ag–Cu solder alloys and joints. Microelectron. Reliab. 78, 72–79 (2017)
5. H.T. Lee, H.S. Lin, C.S. Lee, P.W. Chen, Reliability of Sn–Ag–Sb lead-free solder joints. Mater. Sci. Eng., A 407(1–2), 36–44 (2005)
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