Solidification and interfacial interactions in gold–tin system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging-Reference-Cited by-同舟云学术

Solidification and interfacial interactions in gold–tin system during eutectic or thermo-compression bonding for 200 mm MEMS wafer level hermetic packaging

Published:2013-10-08 Issue:12 Volume:24 Page:5000-5013
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Garnier Arnaud,Baillin Xavier,Hodaj Fiqiri

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-013-1515-5.pdf

Reference40 articles.

1. H. Okamoto, J. Phase Equilib. Diffus. 28, 490 (2007)

2. G. Elger, M. Hutter, H. Oppermann, R. Aschenbrenner, H. Reichl, E. Jager, Microsyst. Technol. 7, 239 (2002)

3. O. Wada, M. Makiuchi, H. Hamaguchi, T. Kumai, T. Mikawa, J. Lightwave Technol. 91, 1200 (1991)

4. M. Hutter, H. Oppermann, G. Engelmann, J. Wolf, O. Ehrmann, R. Aschenbrenner, H. Reichl, in Proceedings of 52nd Electronic Components and Technology Conference, 282 2002

5. M. Volpert, C. Kopp, J. Routin, A. Gasse, S. Bernabe, C. Rossat, M. Tournair, R. Hamelin, V. Lecocq, in Proceedings of 2009 Electronic Components and Technology Conference, 282–288

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient;Micromachines;2023-12-15

2. Influence of Water on Amorphous Lidocaine;Molecular Pharmaceutics;2022-07-25

3. Effects of multiple reflows on microstructure and shear strength of (Au-20Sn)-2Ag/Au/Ni(P)/Kovar joints;Materials Science and Engineering: A;2020-06

4. On the metallic bonding of GaN-based vertical light-emitting diode;Materials Science in Semiconductor Processing;2017-06

5. Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler;Materials Science and Engineering: A;2017-01