Effects of β-Sn grain c-axis on electromigration behavior in BGA Sn3.0Ag0.5Cu solder interconnects-Reference-Cited by-同舟云学术

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Effects of β-Sn grain c-axis on electromigration behavior in BGA Sn3.0Ag0.5Cu solder interconnects

Published:2017-05-18 Issue:15 Volume:28 Page:10785-10793
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Tian Yu,Han Jing,Guo Fu

Funder

Beijing Science Foundation

National Natural Science Foundation of China

Beijing Natural Science Foundation

Science and Technology Project of Beijing Municipal Education Commission

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/article/10.1007/s10854-017-6952-0/fulltext.html

Reference37 articles.

1. M.L. Huang, J.F. Zhao, Z.J. Zhang, N. Zhao, J Alloy Compd. 678, 370 (2016)

2. T. Tian, K. Chen, A.A. MacDowell, D. Parkinson, Y.-S. Lai, K.N. Tu, Scripta Mater. 65, 646 (2011)

3. T.L. Yang, J.J. Yu, C.C. Li, Y.F. Lin, C.R. Kao, J Alloy Compd. 627, 281 (2015)

4. C. Chen, H.M. Tong, K.N. Tu, Annu. Rev. Mater. Res. 40, 531 (2010)

5. B.F. Dyson, T.R. Anthony, D. Turnbull, J. Appl. Phys. 38, 3408 (1967)

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Detrimental angle range between c axis of Sn crystal and electron flow for the electromigration reliability of ball grid array devices;Journal of Materials Science: Materials in Electronics;2022-07-20

2. Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints;Micromachines;2022-06-16

3. The Growth of Interfacial IMC Layer in SAC0307 Solder Joints with Specific Grain Orientation Under Electrical and Thermal Coupling Fields;Journal of Electronic Materials;2019-10-16

4. The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing;Journal of Electronic Materials;2019-01-31

5. The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints;Microelectronics Reliability;2018-01

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