The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints-Reference-Cited by-同舟云学术

The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn-3.0Ag-0.5Cu solder joints

Published:2018-01 Issue: Volume:80 Page:7-13
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Tian Yu,Han Jing,Ma Limin,Guo Fu

Funder

National Natural Science Foundation of China

Beijing Natural Science Foundation

Beijing Municipal Education Commission

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference30 articles.

1. Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration;Zhao,2015

2. Electromigration behaviors of Cu reinforced Sn-3.5Ag composite solder joints;Wang;J. Electron. Mater.,2016

3. Role of diffusion anisotropy in beta-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration;Huang;Acta Mater.,2015

4. Phase-field simulations of intermetallic compound evolution in Cu/Sn solder joints under electromigration;Park;Acta Mater.,2013

5. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011

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