Control of Solder Microstructure Stimulated by Interface Condition of the UBM/Solder and Enhancement of Electromigration Reliability
Author:
Affiliation:
1. University of Texas at Arlington,Arlington,Texas,76019
2. Texas Instruments, Inc,Dallas,Texas,75243
Funder
Semiconductor Research Corporation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195744.pdf?arnumber=10195744
Reference15 articles.
1. Electromigration in solder joints and solder lines
2. Electromigration-induced failure in flip-chip solder joints
3. Relationship Between the Grain Orientation and the Electromigration Reliability of Electronic Packaging Interconnects
4. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
5. Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints
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