Funder
Institut Pengurusan dan Pemantauan Penyelidikan, Universiti Malaya
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference25 articles.
1. T. Xu, X. Hu, Y. Li, X. Jiang, The growth behavior of interfacial intermetallic compound between Sn–3.5 Ag–0.5 Cu solder and Cu substrate under different thermal-aged conditions. J. Mater. Sci.: Mater. Electron. 28(24), 18515–18528 (2017)
2. M. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54, 1741–1768 (2019)
3. M.N. Bashir, A.S.M.A. Haseeb, A.Z.M.S. Rahman, M.A. Fazal, Effect of cobalt doping on the microstructure and tensile properties of lead free solder joint subjected to electromigration. J. Mater. Sci. Technol. 32, 1129–1136 (2016)
4. H.R. Kotadia, P.D. Howes, S.H. Mannan, A review: on the development of low melting temperature Pb-free solders. Microelectron Reliab 54, 1253–1273 (2014)
5. L. Zhang, S.B. Xue, G. Zeng, L. Gao, H. YE, Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging. J. Alloys Compd. 510, 38–45 (2012)
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献