Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn–58Bi/Cu solder joints-Reference-Cited by-同舟云学术

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Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn–58Bi/Cu solder joints

Published:2021-11-05 Issue:1 Volume:33 Page:244-259
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Qin Hongbo^ORCID,Qin Wei,Li Wangyun,Long Xu

Funder

National Natural Science Foundation of China

Natural Science Foundation of Guangxi Province

Science and Technology Planning Project of Guangxi Province

Director Fund Project of Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology

Self-Topic Fund of Engineering Research Center of Electronic Information Materials and Devices

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s10854-021-07289-0.pdf

Reference42 articles.

1. L. Su, X.N. Yu, K. Li, M. Pecht, Defect inspection of flip chip solder joints based on non-destructive methods: a review. Microelectron. Reliab. 110, 113657 (2020). https://doi.org/10.1016/j.microrel.2020.113657

2. X. Yi, R.H. Zhang, X.W. Hu, Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering. J. Manuf. Process. 64, 508–517 (2021). https://doi.org/10.1016/j.jmapro.2021.02.003

3. H. Madanipour, Y.R. Kim, C.U. Kim, D. Mishra, P. Thompson, Study of electromigration in Sn–Ag–Cu micro solder joint with Ni interfacial layer. J. Alloy. Compd. 862, 158043 (2021). https://doi.org/10.1016/j.jallcom.2020.158043

4. C.Y. Cai, J.F. Xu, H.Y. Wang, S.B. Park, A comparative study of thermal fatigue life of Eutectic Sn–Bi, Hybrid Sn–Bi/SAC and SAC solder alloy BGAs. Microelectron. Reliab. 119, 114065 (2021). https://doi.org/10.1016/j.microrel.2021.114065

5. C.J. Lee, K.D. Min, H.J. Park, S.B. Jung, Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests. J. Alloy. Compd. 820, 153077 (2020). https://doi.org/10.1016/j.jallcom.2019.153077

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing;Journal of Electronic Materials;2023-12-12

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