Enhancing void reduction in direct copper bonding through electroless nickel coating on alumina substrates
Author:
Funder
National Science and Technology Council
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s10854-024-13375-w.pdf
Reference18 articles.
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3. J. Schulz-Harder, Advantages and new development of direct bonded copper substrates. Microelectron. Reliab. 43, 359–365 (2003). https://doi.org/10.1016/S0026-2714(02)00343-8
4. W.H. Tuan, S.K. Lee, Eutectic bonding of copper to ceramics for thermal dissipation applications-a review. J. Europ. Ceram. Soc. 34, 4117–4130 (2014). https://doi.org/10.1016/j.jeurceramsoc.2014.07.011
5. S.K. Lee, W.H. Tuan, Eliminating voids at Al2O3–Cu interface during direct bonding. Inter. J. Appl Ceram. Tech. 12, 1020–1026 (2015). https://doi.org/10.1111/ijac.12314
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