Advantages and new development of direct bonded copper substrates-Reference-Cited by-同舟云学术

Advantages and new development of direct bonded copper substrates

Published:2003-03 Issue:3 Volume:43 Page:359-365
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Schulz-Harder Jürgen

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Schulz-Harder J. DBC substrates with reduced ceramic thickness in power semiconductor modules, PCIM Power Conversion, No. 1 (1996) reprint

2. Ready for take off DBC on AlN for power semiconductor;Exel;PCIM Europe Power Electron.,1999

3. Schulz-Harder J. HPS DBC substrates for high reliable applications. Poster at IMAPS Nordic, 2001

4. Schulz-Harder J. Reliability of direct copper bonded (DBC) substrates. Proceedings of ISHM 11th European Microelectronics Conference, Venice, 1997

5. Schulz-Harder J. DBC substrates as a base for power MCM’s. Proceedings of EPTC 2000, Singapore

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