Eliminating Voids at Al2O3-Cu Interface During Direct Bonding-Reference-Cited by-同舟云学术

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Eliminating Voids at Al2O3-Cu Interface During Direct Bonding

Published:2014-09-02 Issue:5 Volume:12 Page:1020-1026
ISSN:1546-542X
Container-title:International Journal of Applied Ceramic Technology
language:en
Short-container-title:Int. J. Appl. Ceram. Technol.

Author:

Lee Shao-Kuan¹,Tuan Wei-Hsing¹

Affiliation:

1. Department of Materials Science and Engineering; National Taiwan University; Taipei 106 Taiwan

Funder

Ministry of Science and Technology, ROC

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Condensed Matter Physics,Ceramics and Composites

Reference25 articles.

1. Thermodynamic analysis of aluminate formation at Fe/Al2O3 and Cu/Al2O3 interfaces

2. Scalable process to produce CuO nanowires and their formation mechanism

3. Interface Reactions Between Metals and Ceramics: IV, Wetting of Sapphire by Liquid Copper-Oxygen Alloys

4. Effect of Oxygen on the Reaction Between Copper and Sapphire

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