Eutectic bonding of copper to ceramics for thermal dissipation applications – A review
Author:
Funder
National Science Council
Publisher
Elsevier BV
Subject
Materials Chemistry,Ceramics and Composites
Reference110 articles.
1. Materials selection in mechanical design;Ashby,1992
2. Joining of SiC fiber-bonded ceramics using silver, copper, nickel palladium, and silicon-based alloy interlayers;Asthana;Int J Appl Ceram Technol,2013
3. Direct ceramic-metal joining: strong bonds;Greenhut;Am Ceram Soc Bull,2002
4. The direct bonding of metals to ceramics by the gas-metal eutectic method;Burgess;J Electrochem Soc,1975
5. The direct bonding of metals to ceramics and application in electronics;Burgess;Electrocomp Sci Technol,1976
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