Joining of SiC Fiber-Bonded Ceramics using Silver, Copper, Nickel, Palladium, and Silicon-Based Alloy Interlayers

Author:

Asthana Rajiv1,Singh Mrityunjay2,Lin Hua-Tay3,Matsunaga Tadashi4,Ishikawa Toshihiro4

Affiliation:

1. Department of Engineering & Technology; University of Wisconsin-Stout; Menomonie; Wisconsin; 54751

2. Ohio Aerospace Institute; 22800 Cedar Point Road; Cleveland; Ohio; 44142

3. Materials Science and Technology Division; Oak Ridge National Laboratory; Oak Ridge; Tennessee; 37831-6068

4. Inorganic Specialty Products Research Laboratory; Ube Industries, Ltd.; 1978-5 Kogushi; Ube-shi; 755-8633; Japan

Publisher

Wiley

Subject

Materials Chemistry,Marketing,Condensed Matter Physics,Ceramics and Composites

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