Funder
The National Key R&D Program of China
Natural Science Foundation of China
Key project of State Key Laboratory of Advanced Welding and Joining
Six talent peaks project in Jiangsu Province
The Qing Lan Project, the China Postdoctoral Science Foundation funded project
International Cooperation Project
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Z.Q. Liu, M.Y. Li, Foundation of Lead-Free Soldering Technology (Science Press, Beijing, 2017)
2. M.Y. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54(2), 1741–1768 (2019)
3. L. Zhang, S.B. Xue, G. Zeng et al., Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging. J. Alloys Compd. 510(1), 38–45 (2012)
4. L. Zhang, L. Sun, Y.H. Guo, Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints. J. Mater. Sci. 26(10), 7629–7634 (2015)
5. O. Mokhtari, H. Nishikawa, Correlation between microstructure and mechanical properties of Sn-Bi-x solders. Mater. Sci. Eng. A 651, 831–839 (2016)
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