Thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections under different stress levels-Reference-Cited by-同舟云学术

Thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections under different stress levels

Published:2007-06-30 Issue:4 Volume:19 Page:393-398
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Zhang X. P.,Yin L. M.,Yu C. B.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-007-9351-0.pdf

Reference17 articles.

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2. B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters, P. Cusack, Rpt., Dept. Trade & Ind. 1, (1999)

3. K.N. Tu, A.M. Gusak, M. Li, J. Appl. Phys. 93, 1335 (2003)

4. H. John, L. Pang, B.S. Xiong, T.H. Low,Electronic Components and Technology Conference ( 2004 ) pp. 1333–1337

5. K.J. Puttlitz, G.T. Galyon, J. Mater. Sci. Mater. Electron. 18, 347 (2007)

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