Mechanical properties of interconnection interfaces in micro tin-silver-copper solder joints
Author:
Affiliation:
1. China Academy of Space Technology,China Aerospace Components Engineering Center,Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9948218/9948219/09948390.pdf?arnumber=9948390
Reference15 articles.
1. Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint
2. Growth behaviors of IMCs in low-silver lead-free Sn1.0Ag0.5Cu micro-joints for long-term high-temperature environments
3. Mechanical properties of Pb-free SnAg solder joints
4. Thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections under different stress levels
5. Nanoindentation: a suitable tool to determine local mechanical properties in microelectronic packages and materials?
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