Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. S.A.C. Al, S.M. Technology, V. Iss, M.O. Components, J.H. Vincent, H.A.H. Steen, Lead-free reflow soldering for electronics assembly. Solder. Surf. Mt. Technol. 13, 21–38 (2001)
2. M.S. Gumaan, R.M. Shalaby, E.A.M. Ali, M. Kamal, Copper effects in mechanical, thermal and electrical properties of rapidly solidified eutectic Sn–Ag alloy. J. Mater. Sci. Mater. Electron. 29, 8886–8894 (2018)
3. E.A.M. Shalaby, R.M. Kamal, M. Ali et al., Design and properties of new lead-free solder joints using Sn-3.5Ag-Cu solder. Silicon. 10, 1861–1871 (2018)
4. P.J.A. Verma, S.P. Tewari, Vibratory stress, solidification and microstructure of weldments under vibratory welding condition—A review, Int. J. Eng. Sci. Technol. 3 (2011) 5215–5220. https://www.scribd.com/document/332150758/VIBRATORY-STRESS-SOLIDIFICATION-AND-MICROSTRUCTURE-OF-WELDMENTS-UNDER-VIBRATORY-WELDING-CONDITION-A-REVIEW-pdf. Accessed June 26, 2019
5. X.R.Z.F.X. Che, W.H. Zhu, E.S.W. Poh, X.W. Zhang, The study of mechanical properties of Sn-Ag-Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures. J. Alloys Compd. 507, 215–224 (2010)
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