Author:
Taneja Divya,Volpert Marion,Hodaj Fiqiri
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference47 articles.
1. K.N. Tu, Solder Joint Technology: Materials, Properties, and Reliability. (Springer, New York, 2007)
2. K.N. Tu, Microelectron. Reliab. 51, 517 (2011)
3. K. Zeng, K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002)
4. T. Laurila, V. Vuorinen, J.K. Kivilahti, Mater. Sci. Eng. R 49, 1 (2005)
5. J. Bertheau, F. Hodaj, N. Hotellier, J. Charbonnier Intermetallics 51, 37 (2014)
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献