Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging-Reference-Cited by-同舟云学术

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Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging

Published:2016-11-03 Issue:4 Volume:28 Page:3685-3694
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Ma Yunzhu,Wu Tong,Liu Wensheng,Huang Yufeng,Tang Siwei,Wang Yikai

Funder

the National 863 Plan Project of China

the National 973 Plan Project of China

the “Chang Jiang Scholars Program” of the Ministry of Education of China

the Fundamental Research Funds for the Central Universities of Central South University

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-016-5974-3.pdf

Reference28 articles.

1. Y. Li, K. Luo, A.B.Y. Lim, Z. Chen, F. Wu, Y.C. Chan, Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement. Mater. Sci. Eng. A 669, 291–303 (2016)

2. Z. Yang, W. Zhou, P. Wu, Effects of Ni-coated carbon nanotubes addition on the microstructure and mechanical properties of Sn–Ag–Cu solder alloys. Mater. Sci. Eng. A 590, 295–300 (2014)

3. V. Chidambaram, J. Hald, J. Hattel, Development of Au–Ge based candidate alloys as an alternative to high-lead content solders. J. Alloys Compd. 490, 170–179 (2010)

4. V. Chidambaram, H.B. Yeung, G. Shan, Reliability of Au–Ge and Au–Si eutectic solder alloys for high-temperature electronics. J. Electron. Mater. 41, 2107–2117 (2012)

5. C. Leinenbach, F. Valenza, D. Giuranno, H.R. Elsener, S. Jin, R. Novakovic, Wetting and soldering behavior of eutectic Au–Ge alloy on Cu and Ni substrates. J. Electron. Mater. 40, 1533–1541 (2011)

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A systematic literature review: The effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints;Journal of Manufacturing Processes;2022-11

2. Growth of the nano-phase intermetallic compounds and its effect on mechanical behavior of Au80Sn20/CrMnFeCoNi solder joints during isothermal aging;Journal of Alloys and Compounds;2021-04

3. Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint;Metals;2020-10-15

4. Effects of isothermal aging on interfacial microstructure evolution and shear behavior of Au-12Ge/Ni(P)/Kovar Solder Joints;Intermetallics;2020-09

5. Correlation between Solidified Microstructure Evolution and Undercooling of Au-12 Wt.%Ge Eutectic Alloy;Materials Science Forum;2020-05

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