Effects of isothermal aging on interfacial microstructure evolution and shear behavior of Au-12Ge/Ni(P)/Kovar Solder Joints-Reference-Cited by-同舟云学术

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Effects of isothermal aging on interfacial microstructure evolution and shear behavior of Au-12Ge/Ni(P)/Kovar Solder Joints

Published:2020-09 Issue: Volume:124 Page:106865
ISSN:0966-9795
Container-title:Intermetallics
language:en
Short-container-title:Intermetallics

Author:

Huang Yufeng,Chen Xun,Xue Feng,Wu Tong,Liu Wensheng,Ma Yunzhu,Tang Siwei

Funder

China Postdoctoral Science Foundation

National Defense Pre-Research Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry

Reference23 articles.

1. Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement;Li;Mater. Sci. Eng., A,2016

2. Effects of Ni-coated carbon nanotubes addition on the microstructure and mechanical properties of Sn–Ag–Cu solder alloys;Yang;Mater. Sci. Eng., A,2014

3. Reliability of Au-Ge and Au-Si eutectic solder alloys for high-temperature electronics;Chidambaram;J. Electron. Mater.,2012

4. Development of Au–Ge based candidate alloys as an alternative to high-lead content solders;Chidambaram;J Alloy Compd,2010

5. Development of high-temperature solders: Review;Zeng;Microelectron. Reliab.,2012

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Exploration of pretreatment process and wettability of high bonding Ni-P coatings on W-Cu composites for electronic packaging;Applied Surface Science;2024-11

2. Effect of thermal exposure on microstructure, orientation relationship, residual stress and failure mechanism of ultrasonic-assisted Kovar/SnSb10/Kovar joints;Materials Characterization;2024-01

3. Ultrasound-induced interinhibitive dissolution-precipitation evolution and significantly improved mechanical properties of Kovar/SnSb10 assembly;Journal of Materials Research and Technology;2023-09

4. Effect of Thermal Exposure on Microstructure, Orientation Relationship, Residual Stress and Failure Mechanism of Ultrasonic-Assisted Kovar/Snsb10/Kovar Joints;2023

5. Microstructure and properties of intermetallic compounds of W/Ni/Ta diffusion couple;Intermetallics;2022-12

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