1. H.J. Ji, M.G. Li, S. Ma, M.Y. Li, Ni3Sn4-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging. Mater. Des. 108, 590–596 (2016)
2. L. Sun, L. Zhang, Properties and microstructures of Sn-Ag-Cu-X lead-free solder joints in electronic packaging. Adv. Mater. Sci. Eng. 2015, 1–16 (2015)
3. Z. Sheng, Prediction on Thermal Fatigue Life & Study on the Reliability of QFP Soldered Joint[D]. (Nanjing University of Aeronautics and Astronautics, Nanjing, 2012)
4. S. Tian, S.P. Li, J. Zhou, P. Xue, R.H. Cao, F.J. Wang, Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints. J. Mater. Sci.: Mater. Electron. 28(21), 16120–16132 (2017)
5. Y.L. Wang, G.X. Wang, K.X. Song, K.K. Zhang, Effect of Ni addition on the wettability and microstructure of Sn2.5Ag0.7Cu0.1RE solder alloy. Mater. Des. 119, 219–224 (2017)