Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference22 articles.
1. Recent progress in SLID bonding in novel 3D-IC technologies;Sun;J Alloys Compd,2019
2. Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology;Tu;Mater Sci Eng R Rep,2019
3. Adhesive bonding for mechanically stacked solar cells;Mathews;Prog Photovoltaics Res Appl,2015
4. Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles;Yoon;J Micromech Microeng,2012
5. Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC;Zhang;Solder Surf Mt Technol,2017
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Orthogonal design optimization for Cu/Sn58Bi-0.4Mg/Cu solder joint strength in ultrasonic-assisted soldering;Materials Today Communications;2024-03
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