Solvent modulation, microstructure evaluation, process optimization, and nanoindentation analysis of micro-Cu@Ag core–shell sintering paste for power electronics packaging
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s10854-023-11083-5.pdf
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4. N. Jiang, L. Zhang, Z.Q. Liu et al., Sci. Technol. Adv. Mater. (2019). https://doi.org/10.1080/14686996.2019.1640072
5. M. Xiong, L. Zhang, J. Mater. Sci. (2018). https://doi.org/10.1007/s10853-018-2907-y
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