Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. U. Gosele, Q.-Y. Tong, Annu. Rev. Mater. Sci. 28, 215 (1998)
2. Q.-Y. Tong, U. Gosele, Semiconductor Wafer Bonding: Science and Technology (John Wiley & Sons, New York, 1999)
3. A. Plößl, G. Kräuter, Mater. Sci. Eng. Rep. 25, 1 (1999)
4. C.J. Barbe, D.J. Cassidy, G. Triani et al., Thin Solid Films 488, 153 (2005)
5. S.N. Farrens, C.E. Hunt, B.E. Roberds, J.K. Smith, J. Electrochem. Soc. 141, 3225 (1994)
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