Author:
Barbé C.J.,Cassidy D.J.,Triani G.,Latella B.A.,Mitchell D.R.G.,Finnie K.S.,Short K.,Bartlett J.R.,Woolfrey J.L.,Collins G.A.
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Silicon-on-lnsulator Technology: Past Achievements and Future Prospects
2. Proceedings of the 4th International Conference on Joining Ceramics, Konigswinter, Germany, May 17–19, 1993;Elssner,1994
3. Wafer-Bonding and Thinning Technologies
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