A Kinetics Study of the Bond Strength of Direct Bonded Wafers-Reference-Cited by-同舟云学术

A Kinetics Study of the Bond Strength of Direct Bonded Wafers

Published:1994-11-01 Issue:11 Volume:141 Page:3225-3230
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:
Short-container-title:J. Electrochem. Soc.

Author:

Farrens S. N.¹²,Hunt C. E.¹²,Roberds B. E.¹²,Smith J. K.¹²

Affiliation:

1. Electrical and Computer Engineering Department, Engineering Unit II, University of California, Davis, California 95616

2. Mechanical, Aeronautical, and Materials Engineering Department, Engineering Unit II, University of California, Davis, California 95616

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

https://iopscience.iop.org/article/10.1149/1.2059307/pdf

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