Temperature Dependence of Young's Modulus and Internal Friction in Sn-Zn-Al Lead-Free Solder
Author:
Affiliation:
1. Department of Mechanical and Systems Engineering, Faculty of Engineering, Gifu University
Publisher
Japan Society of Mechanical Engineers
Link
http://www.jstage.jst.go.jp/article/jmmp/2/8/2_8_981/_pdf
Reference5 articles.
1. Dependence of frequency on Young's modulus and internal friction in Sn–9Zn and Sn–3.5Ag eutectic lead-free solders
2. Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders
3. (3) Kitajima, M., Shono, T., Yamazaki, K. and Noguchi, M., Fundamental physics of Sn-Zn-Al solder (in Japanese), 34th Micro Joining Soldering Subcommittee, Japan Welding Society (2002), pp. 41-45.
4. Creep and Creep Rupture Properties of Sn-8Zn-3Bi Solder
5. (5) Homma, H., Development and the application of Sn-Zn-Al lead free solder, Japan Institute of Electronics Packaging, Vol. 8 (2005), pp. 404-409.
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