Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders-Reference-Cited by-同舟云学术

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Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

Published:2005-06 Issue:12 Volume:40 Page:3267-3269
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Nakamura Y.,Ono T.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10853-005-2698-9.pdf

Reference4 articles.

1. T. OHOKA, Y. NAKAMURA and T.ONO, J. Mater. Sci 39 (2004) 4379.

2. B. M. DRAPKIN, A. A. BIRFEL’D, V. K. KONONEKO and YU. N. KALYUKIN, Phys. Met. Metal 49 (1980) 150.

3. V. S. POSTNIKOV, I. M. SHARSHAKOV and E. M. MASLENNIKOV, Metallurgiya (1963) 165.

4. L. ROTHERHAM, A. D. N. SMITH and G. B. GREENNOUGH, J. Inst. Met 79 (1951) 439.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Hillock formation in β-Sn films during high frequency cyclic bending at low strains;Thin Solid Films;2022-01

2. STRUCTURAL, SURFACE AND TRANSPORT PROPERTIES OF Sn–Ag ALLOYS;Surface Review and Letters;2017-03-30

3. Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction;Journal of Electronic Materials;2009-09-16

4. Temperature Dependence of Young's Modulus and Internal Friction in Sn-Zn-Al Lead-Free Solder;Journal of Solid Mechanics and Materials Engineering;2008

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