Creep and Creep Rupture Properties of Sn-8Zn-3Bi Solder

Author:

TAKADA Akio,SAKANE Masao,TSUKADA Yutaka

Publisher

Society of Materials Science, Japan

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference13 articles.

1. 1) H. Nose, M. Sakane, Y. Tsukada and H. Nishimura, “Effect of Temperature and Strain Rate on Mechanical Property of Sn-Pb Solders”, Transactions of the Japan Society of Mechanical Engineers, Vol.A65, No.632, pp.901-908 (1999).

2. Multiaxial Low Cycle Fatigue of 63Sn-37Pb Solder.

3. 3) M. Taneda, K. Kaminishi and S. Motohiro, “Creep-Fatigue Life Evaluation of Solder Based on Creep Characteristics”, Transactions of the Japan Society of Mechanical Engineers, Vol.A64, No.617, pp.50-57 (1998).

4. 4) H. Yamamoto, M. Sakane, Y. Tsukada and H. Nishimura, “Creep-fatigue life evalution of 63Sn-37Pb Solder”, Proceedings of the 36th Symposium on Strength of Materials at High temperatures, pp.15-19 (1998).

5. 5) H. Takahashi, M. Mukai, T. Kawakami and K. Takahashi, “Effect of Strain Wave on Low Cycle Fatigue Life of Sn-3.5Ag Solder”, Proceedings of 48th Annual Meeting of the Japan Society of Materials Science, pp.97-98 (1999).

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